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Semi-automatic brittle material cutting equipment
Product description:
A device that uses ultra-narrow pulse width laser to concentrate light inside optical glass, mobile phone cover, thick glass, and LCD screen to achieve special-shaped cutting. Using CCD for precise positioning and laser cutting with PSO function, it can control the laser point spacing very well and ensure the cutting quality. The cutting fixture adopts a large-format platform, which is compatible with products of different sizes.
Product parameters:
Device model: DS-LCD-IRP-010-450
Product size: ≤450mm
Cutting accuracy: ≤ ±50μm
Cutting speed: 50-80 mm/S
Marble platform positioning accuracy: ≤±3μm
Repeat positioning accuracy: ≤ ±lμm
Fixture format: 500mm*500mm

Contact:
Company Email:service@zdkfh-ie.com
Contact Number:0351--6523746

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